Technical
2026-03-28

Surface Treatment for Semiconductor Equipment Parts

Semiconductor processing environments are extreme — vacuum, heat, corrosive gases, and plasma all attack equipment parts. Surface treatment is key to longevity and process stability.

Surface Treatment for Semiconductor Equipment Parts

Semiconductor equipment exposes metal parts to extreme conditions — vacuum, heat, corrosive gases, and plasma. Surface treatment isn't optional; it's a fundamental design consideration.

Common surface treatments

  • Anodizing (aluminum) — clear, color, hard anodizing (25-50 μm) for wear and corrosion resistance.
  • Nickel plating — including electroless nickel-phosphorus, providing uniform thickness over complex shapes.
  • PVD / DLC coatings — TiN, CrN, AlTiN for extreme wear and low-friction applications.
  • Electropolishing + passivation — standard for stainless parts in process chambers.

Selection considerations

Choose based on environment (vacuum, gases, temperature), mechanical and electrical requirements, cleanliness level (Class 100 / Class 10 packaging), and cost. The right surface treatment can extend part life 3-5×; the wrong one fails within days.

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